In the manufacturing of precision electronic components, sandblasting is a critical step in surface treatment, directly affecting product conductivity, soldering performance, and corrosion resistance. However, improper selection of sandblasting media can lead to component damage, residual contamination, or even functional failure. How to choose the right media from numerous options? This article combines industry practices and performance comparisons to provide high-value selection strategies for industrial procurement managers and production process engineers.
I. Four Core Requirements for Sandblasting Precision Electronic Components
- Micron-Level Precision Control: Media must be uniform and fine to avoid scratching microcircuits or precision contacts.
- Zero Chemical Residue: Media must be high-purity and easy to clean, preventing impacts on conductivity or oxidation.
- Low Impact Force: Avoid excessive force that could cause cracks in brittle materials (e.g., ceramic substrates).
- Balance of Environmental and Cost Considerations: Compliance with RoHS/REACH standards while ensuring cost-effective reuse.
II. Performance Comparison and Application Scenarios of Mainstream Sandblasting Media
- Glass Beads: The Preferred Choice for Precision Polishing Advantages:
Spherical structure + Mohs hardness of 5-6, achieving scratch-free matte finishes, ideal for PCB boards and connector surface treatment.
Can be reused 10-15 times, reducing overall costs by over 30%.
Limitations: Not suitable for removing ultra-hard coatings (e.g., aluminum nitride).
Recommended Grit Size: 80-150 mesh (micron-level uniform distribution).
- Aluminum Oxide (Corundum): Efficient Deburring but Use with Caution Advantages:
High hardness (Mohs 9) for rapid removal of metal burrs, suitable for thick metal parts like heat sinks.
Risks: Angular structure may damage delicate components; requires precise air pressure control (recommended ≤0.3MPa).
- Plastic Abrasives (PE/PMMA): Safe Solution for Sensitive Components Advantages:
Low hardness (Mohs 2-3), gentle impact to protect semiconductor packaging.
Anti-static formulations prevent dust adhesion, suitable for optical components like camera modules.
Note: Requires regular screening to prevent efficiency loss due to particle aging.
- Sodium Bicarbonate (Baking Soda): Eco-Friendly but High Consumption Applications: Non-contact cleaning of resin residues on IC packaging surfaces, biodegradable.
Drawbacks: Consumption is 3 times that of glass beads, leading to higher long-term costs.
III. Selection Decision Flowchart: 4 Steps to Identify the Optimal Media
Component Material Diagnosis:
Brittle materials (e.g., ceramics) → Plastic abrasives/sodium bicarbonate
Metal substrates → Glass beads/aluminum oxide (based on hardness requirements)
Process Goal Prioritization:
Matte finish → Glass beads; deep cleaning → Aluminum oxide; coating removal → Sodium bicarbonate
Cost Simulation: Compare single-use cost and reuse cycles (Formula: Total cost = Unit price × Single consumption ÷ Reuse cycles)
Small-Batch Verification: Test 2-3 media types, evaluate surface roughness (Ra value) and yield rate changes.
IV. Industry Case: Optimization Path of a Leading Connector Manufacturer
Problem: Microscopic cracks appeared on 304 stainless steel contacts after sandblasting, leading to poor conductivity.
Solution: Replaced aluminum oxide with 80-mesh glass beads and reduced air pressure from 0.5MPa to 0.2MPa.
Result: Yield rate increased from 82% to 97%, media costs decreased by 40%.
V. Conclusion: Glass Beads Remain Dominant, but Scenario-Based Selection is Key
Glass beads dominate over 60% of the precision electronics market due to their balanced performance, but the efficiency of aluminum oxide and the low-damage properties of plastic abrasives are irreplaceable. When procuring, request free sample testing and custom grit size services from suppliers, and make decisions based on equipment parameters (e.g., nozzle type, recycling system).
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