On May 14, Reuters reported that the U.S. government has approved approximately 10 Chinese companies to procure NVIDIA’s flagship AI chip, the H200. This announcement coincided with NVIDIA CEO Jensen Huang joining former U.S. President Donald Trump’s delegation during a high-level visit to China. As of now, while the purchase licenses have been granted, no actual shipments of the H200 chips have been completed, and collaborations remain in the preparatory stage.
The list of approved companies includes top-tier Chinese tech giants such as Alibaba, ByteDance, Tencent, and JD.com, as well as distribution partners like Lenovo and Foxconn. According to U.S. licensing regulations, each approved entity may procure up to 75,000 H200 chips, either directly from NVIDIA or through authorized distributors such as Lenovo and Foxconn.
About NVIDIA H200
The NVIDIA H200 represents the pinnacle of AI computing, designed to accelerate large-scale AI workloads including generative AI, deep learning training, and high-performance inference. With enhanced tensor cores, massive memory bandwidth, and energy-efficient architecture, the H200 sets new standards for AI performance and reliability. Prior to U.S. export controls, NVIDIA captured approximately 95% of China’s high-end AI chip market, with China contributing around 13% of NVIDIA’s global revenue. Analysts estimate that China’s AI market could reach $50 billion in 2026, underscoring the substantial demand for cutting-edge AI hardware.
Implications for China’s Liquid Cooling Industry
The introduction of the H200 into Chinese data centers has significant implications for the domestic liquid cooling sector. High-performance AI chips generate substantial heat, necessitating advanced cooling solutions to maintain operational stability, efficiency, and longevity. Liquid cooling has emerged as the most effective method to manage these thermal loads, offering superior heat dissipation, energy savings, and reduced environmental impact compared to traditional air cooling.
Lian Li: Driving Green AI Infrastructure
Lian Li’s liquid cooling solutions are fully compatible with NVIDIA H200, ensuring that data centers can achieve maximum performance without compromising on energy efficiency. Our offerings include:
Custom Cold Plates designed for direct chip-level heat absorption.
CDU (Coolant Distribution Units) that manage thermal flow with high precision.
Liquid-Cooled Server Cabinets tailored for rack-mounted AI servers.
Containerized Data Center Solutions for scalable deployment, ideal for large-scale AI operations.
All Lian Li products are certified under RoHS, CE, and UL standards, reflecting the highest level of safety and environmental compliance. Trusted by industry leaders worldwide, Lian Li continues to advance green AI infrastructure, providing turnkey solutions that enhance compute density while reducing energy consumption.
As NVIDIA H200 chips enter the Chinese market, Lian Li stands ready to support enterprises in deploying high-density AI compute environments efficiently and sustainably. Our integrated liquid cooling solutions are designed to maximize chip performance, enable high reliability, and lead the evolution of energy-conscious data centers.
About Lian Li
Lian Li is a global leader in high-performance liquid cooling solutions, delivering innovative technologies that empower AI, HPC, and enterprise-scale data centers. By combining advanced engineering with sustainable practices, Lian Li ensures that next-generation compute infrastructure remains both powerful and eco-friendly.


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