ACL Digital is excited to announce our participation in the TSMC Technology Symposium 2026, where we will be showcasing our latest innovations in semiconductor and AI-driven chip design at Booth №916.
As the demand for high-performance and scalable AI chips continues to grow, ACL Digital is at the forefront of enabling next-generation silicon solutions. At our booth, visitors can explore cutting-edge AI accelerators built on advanced process nodes ranging from N6 to N2 and beyond. Our expertise spans HBM-integrated architectures, PCIe/UCIe subsystems, and advanced 3DFabric-based chiplet integration — designed to power the future of AI, HPC, and data-intensive applications.
We also bring strong capabilities in developing efficient design flows for emerging technologies such as N2 and A16, ensuring faster time-to-market and optimized performance. Our Centers of Excellence cover a wide spectrum, including AI chips, automotive semiconductors, IoT devices, networking chips, analog & mixed-signal design, semiconductor embedded software, and chiplet engineering.
ACL Digital’s core strengths include end-to-end RTL to GDSII services, high-speed interface subsystems (PCIe, UCIe, DDR, Ethernet), SERDES IP development, and advanced physical implementation for leading-edge nodes. Through trusted collaborations such as the TSMC Design Center Alliance and Arm Approved Design Partner programs, we continue to deliver scalable and reliable semiconductor solutions.
Join us at the symposium to discover how ACL Digital is advancing AI chip innovation across industries. Let’s connect, collaborate, and shape the future of semiconductor technology together.
Contact us at business@acldigital.com to explore how we can enhance your workplace transformation.
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