The semiconductor industry is undergoing a seismic shift — and chiplets are at the center of it.
Instead of building monolithic SoCs, designers are now assembling smaller, modular chiplets — enabling faster time-to-market, cost efficiency, and unprecedented flexibility.
But what makes chiplets so powerful? How does UCIe ensure multi-vendor interoperability? And more importantly — what challenges remain in verification, packaging, and analog-digital integration?
At Semionics, we’ve broken down the answers in a detailed knowledge-sharing session crafted for engineers, professionals, and enthusiasts in microelectronics.
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