Originally published on the Sienovo Engineering Blog. Sienovo is the overseas brand of 深圳信迈 (Shenzhen Xinmai), building edge AI computing solutions for industrial video analytics.
Semiconductor chips are the brains of modern electronics. In fact, in communication, computing, retail, healthcare, and transportation applications, semiconductor chips provide the foundation for various advanced technologies. Global semiconductor sales grew by 6.5% in 2020, and the production demand for related manufacturing equipment increased accordingly.
A Japanese semiconductor equipment manufacturer in the industry is developing a new type of semiconductor lithography machine for 300mm and 200mm wafer advanced packaging processes. The semiconductor lithography system is designed to handle Fan-Out Panel Level Packaging (FOPLP) in semiconductor packaging processes. This new semiconductor lithography system requires multiple reliable, high-end edge computers as support to upgrade equipment performance and achieve high-speed, high-precision imaging. At the same time, this series of edge computers requires a fanless design, high computing power, cost advantages, and interfaces necessary for installing expansion cards. Furthermore, since multiple computers with different functions are installed in one lithography machine, the customer requires flexible IPCs that can support the installation of various CPUs and peripherals.
Intel Platform-Based Solution
The new lithography machine is equipped with seven Sienovo XM-5125 edge computers. One serves as the main controller, and one as the motion control PC. The other five are used as data PCs. The XM-5125 adopts a socket-type CPU design, offering greater flexibility, allowing users to select 10th Gen Intel® Core™ processors based on their application and/or computing power requirements. In addition, the XM-5125 features various I/O and PCIe/PCIe x4/PCIe x16/PCI interfaces for versatile expansion. The XM-5125 supports the installation of various expansion cards. In this case, the main controller needed to connect four high-definition cameras, so a USB expansion card and a customized optical transmission card were installed via PCIe x4. The data PCs in this case use optical interconnect technology for data communication; the XM-5125 utilizes a LAN card installed via its PCIe x16 interface to achieve high-speed data transmission. Similarly, it provides four SATA interfaces for SSD/HDD installation. The XM-5125 also supports Intel® Software RAID (0, 1, 5, 10), enabling users to back up their data and enhance data security.
Indeed, semiconductor equipment manufacturers employing a "precise replication" model aim for solutions that protect their equipment from significant variations, thus prolonging its service life.
XM-5125
| Product Type | Box PC |
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This article was translated from Chinese to English with AI assistance and a light human review. The original is published at Sienovo Blog. The original Chinese source is at CSDN. Learn more about Sienovo edge AI computing.
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