Taesung Secures Major PCB Equipment Order in China
South Korean PCB automation equipment maker Taesung Co., Ltd. (KOSDAQ: 323280) announced a PCB equipment supply contract worth KRW 7.1 billion (approximately $4.75 million USD) with an undisclosed Chinese customer, signed through its Zhuhai subsidiary.
The contract represents approximately 18.86% of the company's 2025 annual revenue.
Contract Details
| Parameter | Detail |
|---|---|
| Contract value | KRW 7.1 billion (~$4.75M USD) |
| Duration | Through May 19, 2029 |
| Equipment type | Etching and cleaning (wet process) |
| Manufacturer | Taesung HQ (South Korea) |
| Local support | TAESUNG (Zhuhai) Technology |
Payment terms: 30% signing / 30% before acceptance / 30% after acceptance / 10% warranty holdback.
Why Wet-Process Equipment Demand Is Rising
AI Server PCBs Require Precision Etching
AI server boards (20-30+ layers) with fine features need:
- Line width/space accuracy: ±10 µm for 50/50 µm L/S patterns
- Etch uniformity: <5% variation across 600 mm panels
- Surface cleanliness: <100 ng/cm² ionic contamination
FC-BGA Substrate Demand
Flip-chip BGA substrates for AI chips require even finer processing:
- Feature size: 15-25 µm line/space (MSAP or SAP process)
- Layer count: 12-20 substrate layers
- Panel handling: Ultra-thin cores (50-100 µm)
Market Context
- Global PCB production equipment spending exceeded $8 billion in 2025
- China accounts for ~55% of global PCB manufacturing capacity
- Wet process equipment represents 15-20% of a typical factory's capex
- Korean equipment makers compete with Japanese (Tokyo Ohka, Screen) and European (Schmid, Atotech) suppliers
What This Signals
- Chinese PCB factories upgrading for finer-feature capabilities
- Korean equipment gaining share via localization (Zhuhai subsidiary)
- AI demand is real capex — 3-year equipment orders confirm conviction
- Localization accelerating — Korean manufacturing + Chinese service model
For Engineers Sourcing PCBs
Equipment upgrades at Chinese manufacturers translate to:
- Better fine-line capability (50/50 µm becoming mainstream)
- Improved yield on high-layer-count boards
- Faster delivery as production capacity expands
- More competitive pricing as efficiency improves
Source: IC&PCB Union / Taesung KOSDAQ filing, May 19, 2026
Originally published at AtlasPCB
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