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Junluan Tsui
Junluan Tsui

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JL 2.4G Bluetooth Low-Latency Audio Headset Solution: Chip Selection, Latency, Hardware Design

JL 2.4G Bluetooth Low-Latency Audio Headset Solution: Chip Selection, Latency, Hardware Design

Dongle Diagram

This document introduces JL's low-latency audio headset solution using 2.4G/Bluetooth technology.

1. Chip Selection

  • USB Dongle Side:
    • JL7016M or JL7086E
    • Capable of 48KHz/16bit stereo output
    • Supports UAC (USB Audio Class) - plug-and-play, no driver required
  • Headset Side:
    • TWS: JL7083G
    • Stereo headphones: JL7083F

2. Audio Transmission Process

Uplink (microphone to host):

  1. Audio sampled via USB (~2.5ms)
  2. Encoded (~1ms)
  3. Transmitted over 2.4G/Bluetooth using LC3 codec at 48KHz/16bit mono

Downlink (host to headset):

  1. Audio LC3 encoded at 48KHz/16bit stereo
  2. Transmitted wirelessly to headset
  3. Decoded (~2ms)
  4. Playback via DAC (~7ms)

3. Latency Performance

  • TWS headphones: ~20ms total latency
  • Over-ear/headband-style headphones: ~17ms total latency

These values are excellent for gaming and multimedia scenarios where low latency is crucial.

Solution Overview

4. JL 2.4G Bluetooth Low-Latency Headset Solution Overview

(1) Chipset & Basic Capabilities

  • JL7016M or JL7086E for USB Dongle (receiver/transmitter)
  • Outputs 48KHz/16bit stereo
  • Supports UAC (plug-and-play with no driver required)

(2) Encoding - Transmission - Decoding Flow

Uplink (mic to host device):

  1. Mic collects sound
  2. USB sampling (~2.5ms)
  3. LC3 encoding (~1ms)
  4. Transmitted via 2.4G/Bluetooth to host (PC/phone)

Downlink (host to headset):

  1. Host audio encoded into LC3 (48KHz/16bit stereo)
  2. Transmitted wirelessly to headset
  3. Decoded (~2ms)
  4. DAC playback (~7ms)

(3) Latency Performance

  • TWS headphones total latency: ~20ms
  • Over-ear headphones total latency: ~17ms
  • Excellent for low-latency needs in gaming/video applications

5. Chip Solution Comparison

Solution Type Dongle Chip Headset Chip Protocol Notes
Old JL7016M-QFN32 JL7018F EDR Legacy solution
New #1 JL7016M-QFN32 JL7083F LC3 Stereo
New #2 JL7086E-QFN32 JL7083F LC3 Stereo
New #3 JL7086E-QFN32 JL7083G LC3 TWS
  • Headband-style gaming headset: JL7086E + JL7083F
  • TWS-style earbuds: JL7086E + JL7083G

Power Consumption

6. Power Consumption Note

2.4G wireless inherently consumes more power. The typical power consumption is around 20-30mA, and currently, this is a design limitation that cannot be significantly reduced.

7. Hardware Block Diagrams

Dongle Side

Dongle Block Diagram
(Typically includes USB interface, JL7016M/7086E chip, 2.4G RF module, and antenna)

Headset Side

Headset Block Diagram
(Typically includes microphone, JL7083F/G chip, speaker/DAC output, battery/power management, and antenna)

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