EV Group Showcases 450nm Pitch Hybrid Bonding and Layer Transfer at ECTC 2026
EV Group (EVG), the Austrian semiconductor equipment manufacturer, has demonstrated a breakthrough at ECTC 2026: 450nm pitch Cu-Cu hybrid bonding with 98% yield across 20 million interconnects — a critical milestone for ultra-dense 3D chip integration powering next-generation AI processors.
Key Technologies Demonstrated
Ultra-Fine Pitch Hybrid Bonding (450nm)
Co-authored with Applied Materials:
- 450nm Cu-Cu interconnect pitch — among the finest demonstrated at production scale
- 98% yield across 20 million interconnects — proving manufacturing viability
- Wafer-to-wafer process using EVG GEMINI® FB production bonding systems
This pitch density enables significantly higher bandwidth die-to-die interfaces than current 2-3μm pitch used in today's HBM stacks.
300nm Pitch Process Integration
A separate paper presents:
- 300nm pitch hybrid bonding with SiCN passivation
- 50nm overlay accuracy
- Fine-grain Cu metallurgy with comprehensive reliability assessment
- Demonstrates readiness for upcoming HBM5/6 generations
IR Layer Transfer (LayerRelease™)
- Fabrication and transfer of fine-pitch RDL using Si temporary carriers
- IR laser release enabling non-destructive layer separation
- Application: heterogeneous integration of pre-fabricated redistribution layers
Maskless Lithography (LITHOSCALE® XT)
- Digital lithography on 310×310mm² panel substrates
- High aspect ratio Cu pillar applications
- Eliminates mask tooling cost for advanced substrate manufacturing
Seven Technical Sessions
EVG's conference program spans the full range of heterogeneous integration — from professional development courses on hybrid bonding fundamentals to frontier research on epitaxial ruthenium layer transfer for single-crystal interconnects.
Why This Matters for PCB Engineers
As chips integrate more dies through hybrid bonding, PCB substrates must support:
- Higher I/O density → finer pitch BGA arrays
- Higher power density → improved thermal via arrays
- Higher signal frequency → ultra-low-loss materials
- Tighter warpage control → precision lamination
Originally published at AtlasPCB
Source: EV Group Press Release, May 19, 2026; IEEE ECTC 2026 Technical Program
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